25 results
Contributors
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- Book:
- Essentials of Pediatric Anesthesiology
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- 05 November 2014
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- 16 October 2014, pp ix-xii
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Manipulation of Wetting Directions Using Nanostructures with Asymmetric Surface Energies
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1648 / 2014
- Published online by Cambridge University Press:
- 20 February 2014, mrsf13-1648-hh03-04
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- 2014
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Contributors
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- Book:
- Runoff Prediction in Ungauged Basins
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- 05 April 2013
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- 18 April 2013, pp ix-xiv
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Contributors
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- Book:
- Capnography
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- 05 August 2011
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- 17 March 2011, pp ix-xii
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Effects of Nanometer-Scale Surface Roughness and Applied Load on the Bond Strength and Contact Resistance of Cu-Cu Bonded 3D ICs
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1036 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 1036-M02-05
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- 2007
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Kinetics of Void Drift in Copper Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F08-03
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- 2006
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Templated Formation of Ordered Metallic Nano-Particle Arrays
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- Journal:
- MRS Online Proceedings Library Archive / Volume 818 / 2004
- Published online by Cambridge University Press:
- 21 March 2011, M3.3.1
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- 2004
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Metallic Island Coalescence: Molecular Dynamics Simulations of Boundary Formation and Tensile Strain in Polycrystalline Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 779 / 2003
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- 15 February 2011, W4.5
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- 2003
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The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects
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- Journal:
- Journal of Materials Research / Volume 15 / Issue 8 / August 2000
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- 31 January 2011, pp. 1797-1802
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- August 2000
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The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D10.2.1
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- 2000
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On the grain size and coalescence stress resulting from nucleation and growth processes during formation of polycrystalline thin films
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- Journal:
- Journal of Materials Research / Volume 14 / Issue 7 / July 1999
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- 31 January 2011, pp. 3164-3168
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- July 1999
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Activation Volume for Inelastic Deformation in Polycrystalline Ag Films at Low Temperatures
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- Journal:
- MRS Online Proceedings Library Archive / Volume 594 / 1999
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- 10 February 2011, 57
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- 1999
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Letter from the President
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- Journal:
- MRS Bulletin / Volume 21 / Issue 12 / December 1996
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- 29 November 2013, pp. 3-4
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- December 1996
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- You have access
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Letter from the President
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- Journal:
- MRS Bulletin / Volume 21 / Issue 1 / January 1996
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- 29 November 2013, p. 4
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- January 1996
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Texture Maps for Orientation Evolution During Grain Growth in Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 403 / 1995
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- 15 February 2011, 63
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- 1995
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Grain Growth in Polycrystalline Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 343 / 1994
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- 15 February 2011, 3
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- 1994
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Materials Reliability in Microelectronics
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- Journal:
- MRS Bulletin / Volume 18 / Issue 12 / December 1993
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- 29 November 2013, pp. 16-18
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- December 1993
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Electromigration and IC Interconnects
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- Journal:
- MRS Bulletin / Volume 18 / Issue 12 / December 1993
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- 29 November 2013, pp. 19-25
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- December 1993
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Evolution of Electromigration-Induced Voids in Single Crystalline Aluminum Lines with Different Crystallographic Orientations
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 351
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- 1993
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The Origins of Epitaxial Orientations in thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 280 / 1992
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- 25 February 2011, 307
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- 1992
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